The standard reflow soldering condition is shown
in the figure below. The temperature in this figure should be
the temperature at the device.
T1:200°C, T2:150±10°C, T3:130±10°C
- a : Pre-heating time : 20 - 40 sec.
- b : Main-heating time : 20 - 30 sec.
- c : Maximum temperature : 230±10°C
- d : Heating rate : 4°C/ sec. max.
- e : Cooling rate : 8°C/ sec. max.